发明授权
- 专利标题: Multilayer ceramic substrate and method for producing same
- 专利标题(中): 多层陶瓷基板及其制造方法
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申请号: US12265984申请日: 2008-11-06
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公开(公告)号: US07670672B2公开(公告)日: 2010-03-02
- 发明人: Yuichi Iida
- 申请人: Yuichi Iida
- 申请人地址: JP Kyoto
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2007-103439 20070411
- 主分类号: H05K3/46
- IPC分类号: H05K3/46
摘要:
In a multilayer ceramic substrate having a cavity, base-material layers are arranged on a base side with respect to an interface between the base and a wall defining a cavity, and a constraining interlayer is arranged on the wall side. A conductive film is arranged between the base-material layers and the constraining interlayer, the base-material layers and the constraining interlayer sandwiching the interface. The effect of the first conductive film results in an increase in the adhesion of the constraining interlayer to the substrate layers, thus enhancing a shrinkage-inhibiting effect of the constraining interlayer.
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