发明授权
- 专利标题: Method of manufacturing a semiconductor device
- 专利标题(中): 制造半导体器件的方法
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申请号: US11715764申请日: 2007-03-08
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公开(公告)号: US07670881B2公开(公告)日: 2010-03-02
- 发明人: Taketomi Asami , Mitsuhiro Ichijo , Satoshi Toriumi
- 申请人: Taketomi Asami , Mitsuhiro Ichijo , Satoshi Toriumi
- 申请人地址: JP
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP
- 代理机构: Cook Alex Ltd.
- 优先权: JP2000-209136 20000710
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
At present, a forming process of a base film through an amorphous silicon film is conducted in respective film forming chambers in order to obtain satisfactory films. When continuous formation of the base film through the amorphous silicon film is performed in a single film forming chamber with the above film formation condition, crystallization is not sufficiently attained in a crystallization process. By forming the amorphous silicon film using silane gas diluted with hydrogen, crystallization is sufficiently attained in the crystallization process even with the continuous formation of the base film through the amorphous silicon film in the single film forming chamber.
公开/授权文献
- US20070202667A1 Method of manufacturing a semiconductor device 公开/授权日:2007-08-30
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