发明授权
US07671114B2 Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder
有权
取代环氧乙烷或氧杂环丁烷化合物与银基，无铅焊料的粘合剂
- 专利标题： Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder
- 专利标题（中）： 取代环氧乙烷或氧杂环丁烷化合物与银基，无铅焊料的粘合剂
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申请号： US12176729申请日： 2008-07-21
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公开(公告)号： US07671114B2公开(公告)日： 2010-03-02
- 发明人: John G. Woods , Yuhshi Lu , Bruce C. B. Chan , Philip T. Klemarczyk , Andrew D. Messana
- 申请人： John G. Woods , Yuhshi Lu , Bruce C. B. Chan , Philip T. Klemarczyk , Andrew D. Messana
- 申请人地址： US CT Rocky Hill
- 专利权人： Henkel Corporation
- 当前专利权人： Henkel Corporation
- 当前专利权人地址： US CT Rocky Hill
- 代理商 Steven C. Bauman
- 主分类号： C08K3/08
- IPC分类号： C08K3/08 ; C08L63/00 ; C08L71/00
摘要：
In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
公开/授权文献
- US20090018239A1 UNDERFILL ADHESIVES 公开/授权日：2009-01-15
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