发明授权
US07671444B2 Empty vias for electromigration during electronic-fuse re-programming
有权
电子熔丝重新编程期间用于电迁移的空通孔
- 专利标题: Empty vias for electromigration during electronic-fuse re-programming
- 专利标题(中): 电子熔丝重新编程期间用于电迁移的空通孔
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申请号: US11767580申请日: 2007-06-25
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公开(公告)号: US07671444B2公开(公告)日: 2010-03-02
- 发明人: Ping-Chuan Wang , Wai-Kin Li
- 申请人: Ping-Chuan Wang , Wai-Kin Li
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Hoffman Warnick LLC
- 代理商 Yunamin Cai
- 主分类号: H01L23/525
- IPC分类号: H01L23/525 ; H01L23/58 ; H01L29/00
摘要:
The disclosure relates generally to integrated circuit (IC) chip fabrication, and more particularly, to an e-fuse device including an opening, a first via and a second via in an interlayer dielectric, wherein the opening, the first via and the second via are connected to an interconnect below the interlayer dielectric; a dielectric layer that encloses the first via and the second via; and a metal layer over the dielectric layer, wherein the metal layer fills the opening with a metal, and wherein the first via and the second via are substantially empty to allow for electromigration of the interconnect during re-programming of the e-fuse device.