发明授权
- 专利标题: Inductive module
- 专利标题(中): 感应模块
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申请号: US12236161申请日: 2008-09-23
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公开(公告)号: US07671716B2公开(公告)日: 2010-03-02
- 发明人: Aaron Chen
- 申请人: Aaron Chen
- 申请人地址: TW Kaohsiung
- 专利权人: Taimag Corporation
- 当前专利权人: Taimag Corporation
- 当前专利权人地址: TW Kaohsiung
- 代理机构: Black Lowe & Graham, PLLC
- 优先权: TW97116077A 20080501
- 主分类号: H01F5/00
- IPC分类号: H01F5/00
摘要:
An inductive module includes an electrically insulating basic substrate unit having opposite first and second trace-forming sides, a ferromagnetic core unit embedded in the basic substrate unit and having horizontal sides substantially parallel to and respectively spaced apart from the first and second trace-forming sides, and a coil unit. The coil unit includes first and second conductive vias respectively formed in the basic substrate unit adjacent to vertical sides of the core unit, and respectively spaced apart from the vertical sides, and first and second conductive traces, each of which is disposed on a corresponding one of the first and second trace-forming sides, and interconnects electrically a corresponding pair of the first and second conductive vias. The conductive traces and the conductive vias of the coil unit cooperate to form an electric current path that substantially winds around the core unit.
公开/授权文献
- US20090273428A1 INDUCTIVE MODULE 公开/授权日:2009-11-05
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