发明授权
- 专利标题: Dual-slice architectures for programmable logic devices
- 专利标题(中): 可编程逻辑器件的双切片架构
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申请号: US12409757申请日: 2009-03-24
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公开(公告)号: US07675321B1公开(公告)日: 2010-03-09
- 发明人: Om P. Agrawal , Xiaojie He , Sajitha Wijesuriya , Barry Britton , Ming H. Ding , Jun Zhao
- 申请人: Om P. Agrawal , Xiaojie He , Sajitha Wijesuriya , Barry Britton , Ming H. Ding , Jun Zhao
- 申请人地址: US OR Hillsboro
- 专利权人: Lattice Semiconductor Corporation
- 当前专利权人: Lattice Semiconductor Corporation
- 当前专利权人地址: US OR Hillsboro
- 主分类号: H01L25/00
- IPC分类号: H01L25/00 ; G06F7/38
摘要:
In one embodiment of the invention, a programmable logic device includes a plurality of programmable logic blocks and a plurality of dual-slice logic blocks within a programmable logic block. A dual-slice logic block includes a first slice including at least two lookup tables (LUTs); a second slice including at least two LUTs; and a routing circuit coupled to each of the LUTs within the first and second slices. The routing circuit is adapted to share outputs of the dual-slice logic block among the LUTs. In another embodiment of the invention, the dual-slice logic block includes a second routing circuit coupled to each of the LUTs within the first and second slices. The second routing circuit is adapted to share inputs of the dual-slice logic block among the LUTs.
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