Invention Grant
- Patent Title: Semiconductor package with redistributed pads
- Patent Title (中): 半导体封装带重新分配的焊盘
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Application No.: US11592408Application Date: 2006-11-03
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Publication No.: US07678609B2Publication Date: 2010-03-16
- Inventor: Mark Pavier
- Applicant: Mark Pavier
- Applicant Address: US CA El Segundo
- Assignee: International Rectifier Corporation
- Current Assignee: International Rectifier Corporation
- Current Assignee Address: US CA El Segundo
- Agency: Farjami & Farjami LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A method for fabricating a semiconductor package which includes coupling an electrode of a semiconductor device to a portion of a lead frame, overmolding at least a portion of the die, and then removing a portion of the die to obtain a desired thickness.
Public/Granted literature
- US20070099343A1 Semiconductor package with redistributed pads Public/Granted day:2007-05-03
Information query
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