发明授权
- 专利标题： Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same
- 专利标题（中）： 具有屏蔽信号线和电镀通孔的电路基板及其制造方法，以及利用其组合和信息处理系统
-
申请号： US11401401申请日： 2006-04-11
-
公开(公告)号： US07679005B2公开(公告)日： 2010-03-16
- 发明人: Benson Chan , Frank D. Egitto , Roy H. Magnuson , Voya R. Markovich , David L. Thomas
- 申请人： Benson Chan , Frank D. Egitto , Roy H. Magnuson , Voya R. Markovich , David L. Thomas
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 代理机构： Hinman, Howard & Kattell
- 代理商 Mark Levy; Lawrence R. Fraley
- 主分类号： H01R12/04
- IPC分类号： H01R12/04 ; H05K1/11 ; H01K3/10
摘要：
A circuitized substrate in which selected ones of the signal conductors are substantially surrounded by shielding members which shield the conductors during passage of high frequency signals, e.g., to reduce noise. The shielding members may form solid members which lie parallel and/or perpendicular to the signal conductors, and may also be substantially cylindrical in shape to surround a conductive thru-hole which also forms part of the substrate. An electrical assembly and an information handling system are also defined.
公开/授权文献
信息查询
