Invention Grant
- Patent Title: Semiconductor device including source strapping line
- Patent Title (中): 半导体装置包括源带捆扎线
-
Application No.: US11520817Application Date: 2006-09-14
-
Publication No.: US07679122B2Publication Date: 2010-03-16
- Inventor: Wook-Hyoung Lee
- Applicant: Wook-Hyoung Lee
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2005-0086616 20050916
- Main IPC: H01L29/94
- IPC: H01L29/94

Abstract:
A semiconductor device includes a plurality of source regions and drain regions disposed on a semiconductor substrate. The semiconductor device also includes a plurality of word lines disposed on the semiconductor substrate between the source regions and the drain regions. The semiconductor device also includes a conductive line disposed on the semiconductor substrate parallel to the word lines. The semiconductor device also includes a plurality of bit lines connected to the drain regions and crossing over the word lines. The semiconductor device also includes a plurality of source strapping lines crossing over the plurality of word lines, the plurality of source strapping lines being connected to at least one of the plurality of source regions and the conductive line. The semiconductor device also includes a ground line connected to the conductive line.
Public/Granted literature
- US20070096187A1 Semiconductor device including source strapping line Public/Granted day:2007-05-03
Information query
IPC分类: