Invention Grant
US07679396B1 High speed integrated circuit 失效
高速集成电路

  • Patent Title: High speed integrated circuit
  • Patent Title (中): 高速集成电路
  • Application No.: US12245704
    Application Date: 2008-10-04
  • Publication No.: US07679396B1
    Publication Date: 2010-03-16
  • Inventor: Richard F.C. Kao
  • Applicant: Richard F.C. Kao
  • Main IPC: H03K17/16
  • IPC: H03K17/16
High speed integrated circuit
Abstract:
Method and apparatus are disclosed for implementing low noise circuits. The method includes providing a first subcircuit and a second subcircuit, where the first subcircuit and the second subcircuit include substantially same circuit elements and have substantially same configuration and layout, providing one or more coupling capacitors configured to couple between a circuit power and a circuit ground that power the first subcircuit and the second subcircuit, providing one or more pairs of differential input signals to the first subcircuit and the second subcircuit, where the first subcircuit receives a differential signal and the second subcircuit receives a complement of the differential signal, operating the first subcircuit and the second subcircuit to generate one or more pairs of differential output signals using the one or more pairs of differential input signals.
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