Invention Grant
- Patent Title: Electric tile modules
- Patent Title (中): 电瓦片模块
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Application No.: US12066259Application Date: 2006-08-03
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Publication No.: US07681363B2Publication Date: 2010-03-23
- Inventor: Mark Banister
- Applicant: Mark Banister
- Agency: Hayes Soloway P.C.
- International Application: PCT/US2006/030139 WO 20060803
- International Announcement: WO2007/019183 WO 20070215
- Main IPC: E04D13/18
- IPC: E04D13/18 ; E04H14/00

Abstract:
The electrically connectable tile module includes a porous substrate having a top side, a bottom side, and at least two side edges. At least one connector is integrated into the porous substrate allowing adjoining electrically connectable tile modules to be electrically connected to the porous substrate. At least one electrical element is disposed over the top side of the porous substrate and electrically connected to the at least one connector.
Public/Granted literature
- US20080313977A1 Electric Tile Modules Public/Granted day:2008-12-25
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