发明授权
- 专利标题: Circuit board for ink jet head, method of manufacturing the same, and ink jet head using the same
- 专利标题(中): 用于喷墨头的电路板,其制造方法和使用其的喷墨头
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申请号: US11203129申请日: 2005-08-15
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公开(公告)号: US07681993B2公开(公告)日: 2010-03-23
- 发明人: Kenji Ono , Teruo Ozaki , Toshiyasu Sakai , Ichiro Saito , Satoshi Ibe , Sakai Yokoyama , Kazuaki Shibata
- 申请人: Kenji Ono , Teruo Ozaki , Toshiyasu Sakai , Ichiro Saito , Satoshi Ibe , Sakai Yokoyama , Kazuaki Shibata
- 申请人地址: JP Tokyo
- 专利权人: Canon Kabushiki Kaisha
- 当前专利权人: Canon Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Fitzpatrick, Cella, Harper & Scinto
- 优先权: JP2004-236604 20040816
- 主分类号: B41J2/05
- IPC分类号: B41J2/05
摘要:
An ink jet head circuit board is provided which has heaters to generate thermal energy for ejecting ink as they are energized. This circuit board is so constructed as to reduce wire resistances for the heaters while at the same time preventing an increase in the size of the board and realizing a high-density integration of the heaters required for high resolution printing. This construction is made possible by forming electrode wires of first and second electrode wire layers to reduce an area that the wire patterns for the heater occupy on the circuit board. In reducing the effective thickness of protective insulation layer formed on the heater to prevent a possible degradation of thermal efficiency, one of the protective insulation layers over the electrode wires is removed from the heater, depending on the thickness of the electrode wires.
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