发明授权
- 专利标题: Electrical contact with retaining device for clipping solder ball
- 专利标题(中): 与夹持焊球保持装置电接触
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申请号: US12286357申请日: 2008-09-29
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公开(公告)号: US07682165B2公开(公告)日: 2010-03-23
- 发明人: Fang-Chu Liao
- 申请人: Fang-Chu Liao
- 申请人地址: TW Taipei Hsien
- 专利权人: Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人: Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人地址: TW Taipei Hsien
- 代理商 Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- 优先权: CN200720044337U 20070929
- 主分类号: H01R12/00
- IPC分类号: H01R12/00
摘要:
An electrical contact (10) using for electrically connecting a chip module to a printed circuit board includes a base portion (101), an arm portion (102) extending from side of the base portion (101), a retaining device (104) extending downwardly from the base portion (101) for retaining a soldering ball (20). The retaining device further comprises a plurality of clipping portions, said clipping portions forming a retaining space (1044) for receiving the soldering ball jointly, and at least one of said clipping portions defining a guiding surface (1046) and a recess (1045). By above way, steady attachment between the soldering ball and the contact is achieved.
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