发明授权
- 专利标题： Integrated endpoint detection system with optical and eddy current monitoring
- 专利标题（中）： 具有光学和涡流监测的集成端点检测系统
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申请号： US11677450申请日： 2007-02-21
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公开(公告)号： US07682221B2公开(公告)日： 2010-03-23
- 发明人: Boguslaw A. Swedek , Manoocher Birang , Nils Johansson
- 申请人： Boguslaw A. Swedek , Manoocher Birang , Nils Johansson
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Fish & Richardson PC
- 主分类号： B24B49/00
- IPC分类号： B24B49/00 ; B24B29/00 ; G01R33/12 ; G01B7/06 ; G06F19/00 ; B24B37/04 ; G01L21/00
摘要：
A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
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