发明授权
US07683377B2 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same 有权
半导体发光器件及其制造方法以及使用其的照明装置及显示装置

  • 专利标题: Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
  • 专利标题(中): 半导体发光器件及其制造方法以及使用其的照明装置及显示装置
  • 申请号: US10563268
    申请日: 2004-07-12
  • 公开(公告)号: US07683377B2
    公开(公告)日: 2010-03-23
  • 发明人: Hideo Nagai
  • 申请人: Hideo Nagai
  • 申请人地址: JP Osaka
  • 专利权人: Panasonic Corporation
  • 当前专利权人: Panasonic Corporation
  • 当前专利权人地址: JP Osaka
  • 优先权: JP2003-275454 20030716
  • 国际申请: PCT/JP2004/010244 WO 20040712
  • 国际公布: WO2005/008791 WO 20050127
  • 主分类号: H01L27/15
  • IPC分类号: H01L27/15
Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
摘要:
The present invention aims to provide a semiconductor light emitting device (1) that may be firmly attached to a substrate with maintaining excellent light emitting efficiency, and a manufacturing method of the same, and a lighting apparatus and a display apparatus using the same. In order to achieve the above object, the semiconductor light emitting device (1) according to the present invention includes a luminous layer (23), a light transmission layer (10) disposed over a main surface of the luminous layer (23), and having depressions (11) on a surface facing away from the luminous layer (23), and a transmission membrane (70) disposed on the light transmission layer (10) so as to follow contours of the depressions, and light from the luminous layer (23) is irradiated so as to pass through the light transmission layer (10) and the transmission membrane (70).
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