发明授权
- 专利标题: Semiconductor device and method for fabricating the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US12122487申请日: 2008-05-16
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公开(公告)号: US07683441B2公开(公告)日: 2010-03-23
- 发明人: Eun Jong Shin
- 申请人: Eun Jong Shin
- 申请人地址: KR Seoul
- 专利权人: Dongbu Hitek Co., Ltd.
- 当前专利权人: Dongbu Hitek Co., Ltd.
- 当前专利权人地址: KR Seoul
- 代理机构: Saliwanchik, Lloyd & Saliwanchik
- 优先权: KR10-2007-0047981 20070517
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/336
摘要:
Provided are a semiconductor device and a method for fabricating the same. The semiconductor device can include a transistor structure, including a gate dielectric on a substrate, a gate electrode on the gate dielectric, a spacer at sidewalls of the gate electrode, and source/drain regions in the substrate; and an interlayer dielectric on the transistor structure where an air gap is provided in a region between the spacer, the interlayer dielectric, and the source/drain region of the substrate.
公开/授权文献
- US20080283937A1 Semiconductor Device and Method for Fabricating the Same 公开/授权日:2008-11-20
信息查询
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