Invention Grant
- Patent Title: Light emitting device package and method for manufacturing the same
- Patent Title (中): 发光器件封装及其制造方法
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Application No.: US11434507Application Date: 2006-05-16
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Publication No.: US07683539B2Publication Date: 2010-03-23
- Inventor: Geun ho Kim , Seung yeob Lee
- Applicant: Geun ho Kim , Seung yeob Lee
- Applicant Address: KR Seoul KR Seoul
- Assignee: LG Electronics Inc.,LG Innotek Co., Ltd.
- Current Assignee: LG Electronics Inc.,LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul KR Seoul
- Agency: McKenna Long & Aldridge LLP
- Priority: KR10-2005-0041235 20050517
- Main IPC: H01J1/62
- IPC: H01J1/62 ; H01J9/00
Abstract:
The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light emitting device is electrically connected to other devices without use of wire bonding, thereby saving a space for wire bonding and reducing the size of a package.
Public/Granted literature
- US20060261292A1 Light emitting device package and method for manufacturing the same Public/Granted day:2006-11-23
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