发明授权
US07684226B2 Method of making high forward current diodes for reverse write 3D cell
有权
制造反向写入3D电池的高正向电流二极管的方法
- 专利标题: Method of making high forward current diodes for reverse write 3D cell
- 专利标题(中): 制造反向写入3D电池的高正向电流二极管的方法
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申请号: US11819079申请日: 2007-06-25
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公开(公告)号: US07684226B2公开(公告)日: 2010-03-23
- 发明人: S. Brad Herner
- 申请人: S. Brad Herner
- 申请人地址: US CA Milpitas
- 专利权人: Sandisk 3D LLC
- 当前专利权人: Sandisk 3D LLC
- 当前专利权人地址: US CA Milpitas
- 代理机构: Foley & Lardner LLP
- 主分类号: G11C17/00
- IPC分类号: G11C17/00
摘要:
A method of making a nonvolatile memory device includes forming a first electrode, forming at least one nonvolatile memory cell including a diode and a metal oxide antifuse dielectric layer over the first electrode, and forming a second electrode over the at least one nonvolatile memory cell. In use, the diode acts as a read/write element of the nonvolatile memory cell by switching from a first resistivity state to a second resistivity state different from the first resistivity state in response to an applied bias.
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