发明授权
US07684226B2 Method of making high forward current diodes for reverse write 3D cell 有权
制造反向写入3D电池的高正向电流二极管的方法

  • 专利标题: Method of making high forward current diodes for reverse write 3D cell
  • 专利标题(中): 制造反向写入3D电池的高正向电流二极管的方法
  • 申请号: US11819079
    申请日: 2007-06-25
  • 公开(公告)号: US07684226B2
    公开(公告)日: 2010-03-23
  • 发明人: S. Brad Herner
  • 申请人: S. Brad Herner
  • 申请人地址: US CA Milpitas
  • 专利权人: Sandisk 3D LLC
  • 当前专利权人: Sandisk 3D LLC
  • 当前专利权人地址: US CA Milpitas
  • 代理机构: Foley & Lardner LLP
  • 主分类号: G11C17/00
  • IPC分类号: G11C17/00
Method of making high forward current diodes for reverse write 3D cell
摘要:
A method of making a nonvolatile memory device includes forming a first electrode, forming at least one nonvolatile memory cell including a diode and a metal oxide antifuse dielectric layer over the first electrode, and forming a second electrode over the at least one nonvolatile memory cell. In use, the diode acts as a read/write element of the nonvolatile memory cell by switching from a first resistivity state to a second resistivity state different from the first resistivity state in response to an applied bias.
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