Invention Grant
- Patent Title: Modules and backplanes
- Patent Title (中): 模块和背板
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Application No.: US11243921Application Date: 2005-10-05
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Publication No.: US07685349B2Publication Date: 2010-03-23
- Inventor: Brian Allen , Terry Thom , Richard Garrett
- Applicant: Brian Allen , Terry Thom , Richard Garrett
- Applicant Address: US WA Liberty Lake
- Assignee: Telect Inc.
- Current Assignee: Telect Inc.
- Current Assignee Address: US WA Liberty Lake
- Agency: Lee & Hayes, PLLC
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/14
Abstract:
Embodiments of a module and backplane are presented herein.
Public/Granted literature
- US20060277342A1 Modules and backplanes Public/Granted day:2006-12-07
Information query
