Invention Grant
- Patent Title: Method of fabricating a probe card
- Patent Title (中): 制造探针卡的方法
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Application No.: US12008483Application Date: 2008-01-11
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Publication No.: US07685705B2Publication Date: 2010-03-30
- Inventor: James E. Nulty , James A. Hunter , Alexander J. Herrera
- Applicant: James E. Nulty , James A. Hunter , Alexander J. Herrera
- Applicant Address: US CA San Jose
- Assignee: Cypress Semiconductor Corporation
- Current Assignee: Cypress Semiconductor Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01R9/00
- IPC: H01R9/00 ; H05K3/00

Abstract:
A probe card for testing dice on a wafer includes a substrate, a number of cantilevers formed on a surface thereof, and a number of probes extending from unsupported ends of the cantilevers. The unsupported ends of the cantilevers project over cavities on the surface of the substrate. The probes have tips to contact pads on the dice under test. The probe card may include a compressive layer above the surface of the substrate with a number of holes through which the probes extend.
Public/Granted literature
- US20080110019A1 Probe card and method for constructing same Public/Granted day:2008-05-15
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