A crimping apparatus and method are provided that enable secure crimping of objects to one another even when the objects are subject to thermal or stress cycling. Specifically, an apparatus for crimping a work-piece includes a die pair with a first die that defines a first groove characterized by a first cross-sectional shape as well as a second die opposing the first die. The second die defines a second groove characterized by a second cross-sectional shape different than the first cross-sectional shape. When the dies are moved together for crimping the work-piece, the first and second grooves are aligned to define a die cavity with a compound cross-sectional shape for crimping the work-piece.