Invention Grant
- Patent Title: Method for manufacturing semiconductor optical device
- Patent Title (中): 制造半导体光学器件的方法
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Application No.: US12049456Application Date: 2008-03-17
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Publication No.: US07687290B2Publication Date: 2010-03-30
- Inventor: Shinji Abe
- Applicant: Shinji Abe
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2007-076871 20070323
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for manufacturing a semiconductor optical device includes: forming a laminated semiconductor structure of GaN-based materials on a semiconductor wafer, the laminated semiconductor structure forming a laser diode of GaN-based materials, including an active layer having a quantum well structure; cleaving the semiconductor wafer including the laminated semiconductor structure to expose a cleaved end face of the laminated semiconductor structure; and forming an SiO2 film on the cleaved end face and performing a heat treatment to cause Ga vacancy diffusion in the active layer to disorder the quantum well structure of the active layer.
Public/Granted literature
- US20080233668A1 METHOD FOR MANUFACTURING SEMICONDUCTOR OPTICAL DEVICE Public/Granted day:2008-09-25
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