Invention Grant
- Patent Title: Chuck with integrated wafer support
- Patent Title (中): 带集成晶圆支架的卡盘
-
Application No.: US12075385Application Date: 2008-03-10
-
Publication No.: US07688091B2Publication Date: 2010-03-30
- Inventor: Peter Andrews , Brad Froemke , John Dunklee
- Applicant: Peter Andrews , Brad Froemke , John Dunklee
- Applicant Address: US OR Beaverton
- Assignee: Cascade Microtech, Inc.
- Current Assignee: Cascade Microtech, Inc.
- Current Assignee Address: US OR Beaverton
- Agency: Chernoff, Vilhauer, McClung & Stenzel
- Main IPC: G01R31/02
- IPC: G01R31/02
Abstract:
An improved chuck with lift pins within a probe station. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.
Public/Granted literature
- US20080157796A1 Chuck with integrated wafer support Public/Granted day:2008-07-03
Information query
