Invention Grant
- Patent Title: Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
- Patent Title (中): 具有缓冲机构和基板转印装置的基板处理装置
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Application No.: US11512637Application Date: 2006-08-30
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Publication No.: US07690881B2Publication Date: 2010-04-06
- Inventor: Takayuki Yamagishi , Tamihiro Kobayashi , Akira Watanabe , Kunihiro Kaneuchi
- Applicant: Takayuki Yamagishi , Tamihiro Kobayashi , Akira Watanabe , Kunihiro Kaneuchi
- Applicant Address: JP Tokyo
- Assignee: ASM Japan K.K.
- Current Assignee: ASM Japan K.K.
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: B65G49/07
- IPC: B65G49/07

Abstract:
A substrate transfer apparatus for loading and unloading substrates in a reaction chamber, includes: an arm having a distal end which is laterally movable in a straight line direction; and end-effectors for loading and unloading substrates in a reaction chamber, which include a lower end-effector and an upper end-effector. One of the lower end-effector or the upper end-effector is movably coupled to the arm at a distal end of the arm, and the other end-effector is fixed to the movably coupled end-effector. The fixed end-effector is fixed to the movably coupled end-effector.
Public/Granted literature
- US20080056854A1 Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus Public/Granted day:2008-03-06
Information query
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