发明授权
US07692101B2 Reduction of jitter in a semiconductor device by controlling printed circuit board and package substrate stackup
有权
通过控制印刷电路板和封装衬底叠层来减少半导体器件中的抖动
- 专利标题： Reduction of jitter in a semiconductor device by controlling printed circuit board and package substrate stackup
- 专利标题（中）： 通过控制印刷电路板和封装衬底叠层来减少半导体器件中的抖动
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申请号： US12008353申请日： 2008-01-09
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公开(公告)号： US07692101B2公开(公告)日： 2010-04-06
- 发明人: Anthony T. Duong
- 申请人： Anthony T. Duong
- 申请人地址： US CA San Jose
- 专利权人： Xilinx, Inc.
- 当前专利权人： Xilinx, Inc.
- 当前专利权人地址： US CA San Jose
- 代理商 Thomas A. Ward; John J. King; Thomas George
- 主分类号： H05K1/00
- IPC分类号： H05K1/00
摘要：
A model and method are provided for lowering device jitter by controlling the stackup of PCB planes so as to minimize inductance between a FPGA and PCB voltage planes for critical core voltages within the FPGA. Furthermore, a model and method are provided for lowering jitter by controlling the stackup of package substrate planes so as to minimize inductance between a die and substrate voltage planes for critical core voltages within the die.
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