发明授权
- 专利标题： Heat sink with heat pipes
- 专利标题（中）： 带热管的散热器
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申请号： US11309811申请日： 2006-10-02
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公开(公告)号： US07694718B2公开(公告)日： 2010-04-13
- 发明人: Cheng-Tien Lai , Zhi-Yong Zhou , Yi-San Liu
- 申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Yi-San Liu
- 申请人地址： CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 专利权人： Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- 当前专利权人： Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- 当前专利权人地址： CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 代理商 Frank R. Niranjan
- 主分类号： F28D15/00
- IPC分类号： F28D15/00 ; H05K7/20
摘要：
A heat sink includes a first plate having a top portion and a bottom portion, a second plate projecting from the top portion of the first plate, and a plurality of fins thermally contacting the second plate. The second plate has a width larger than that of the first plate. The heat pipe includes a first portion embedded in the bottom portion of the first plate for directly contacting an electronic component to be cooled, and a second portion bent from one end of the first portion. The second portion is located at one side of the first plate, while the first portion of the heat pipe is located at a middle of the first plate.
公开/授权文献
- US20080078528A1 HEAT SINK WITH HEAT PIPES 公开/授权日：2008-04-03
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