An electronic device comprises a substrate and at least a warped spring connector. The substrate has a signal bonding pad and a ground plane. The warped spring connector is disposed on the substrate and is connected to the bonding pad. The warped spring connector includes at least a ground lead electrically connected to the ground plane, a dielectric layer on the ground lead, and a transmitting lead on the dielectric layer. The transmitting lead is bonded to the bonding pad. The ground lead is isolated from and close to the transmitting lead to solve cross-talk and noise problem. Furthermore, the coefficient of thermal expansion of the transmitting lead is different from that of the dielectric layer or the ground lead such that the warped spring connector has a suspending end suspending away from the substrate.