Invention Grant
- Patent Title: Digital camera module and method for assembling the same
- Patent Title (中): 数码相机模块及其组装方法
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Application No.: US11687114Application Date: 2007-03-16
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Publication No.: US07697056B2Publication Date: 2010-04-13
- Inventor: Shih-Lung Huang
- Applicant: Shih-Lung Huang
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Zhigang Ma
- Priority: TW95143816A 20061127
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
An exemplary digital camera module (200) includes a lens module (20), a chip package (30) and a focusing structure (40). The lens module includes a holder (24) and a barrel slidably received in the holder. At least one lens element (222) is fixed in the barrel. The holder has several channels (246) defined therein. Each channel respectively has an enlarged end opening (2468) and receives a corresponding wire (28) therein. The focusing structure is attached to the holder. Several pads (36) are formed on the surface of the chip package. Each wire electrically connects with a given pad using a conductive adhesive (52), and, via such a connection, the chip package is able to control the focusing structure to drive movement of the barrel. The respective enlarged end openings serve to help retain the corresponding conductive adhesive proximate/adjacent a given pad.
Public/Granted literature
- US20080122967A1 DIGITAL CAMERA MODULE AND METHOD FOR ASSEMBLING THE SAME Public/Granted day:2008-05-29
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