Invention Grant
- Patent Title: Method based on backboard transmitting time division multiplexing circuit data and a bridge connector
- Patent Title (中): 基于背板传输时分复用电路数据和桥接器的方法
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Application No.: US10476407Application Date: 2002-04-29
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Publication No.: US07697570B2Publication Date: 2010-04-13
- Inventor: Zhenya Li , Guzheng Wu , Quan Yu , Shoubo Xie , Konggang Wei
- Applicant: Zhenya Li , Guzheng Wu , Quan Yu , Shoubo Xie , Konggang Wei
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Priority: CN01115803 20010430; CN01130714 20010821
- International Application: PCT/CN02/00306 WO 20020429
- International Announcement: WO02/098162 WO 20021205
- Main IPC: H04J3/00
- IPC: H04J3/00

Abstract:
A method for multi-path TDM data transmission includes: applying a plurality of high-speed serial lines to connect a center switch network board to a plurality of service boards; multiplexing multi-path TDM data from the center switch network board at transmitting side, and transmitting TDM data multiplexed in batch via one of the high-speed serial lines to one of the service boards; at receiving side, serial receiving the TDM data multiplexed and de-multiplexing the TDM data multiplexed to multiple TDM paths. The TDM bridge connector includes: a TDM high-speed serial transmitting adaptive circuit, and a TDM high-speed serial receiving adaptive circuit and a clock control circuit. The invention increases greatly transmission capacity and looses the requirement of clock synchronization, so the system reliability is greatly raised.
Public/Granted literature
- US20040120351A1 Method based on backboard transmitting time division multiplexing circuit data and a bridge connector Public/Granted day:2004-06-24
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