Invention Grant
- Patent Title: Three-dimensional structural damage localization system and method using layered two-dimensional array of capacitance sensors
- Patent Title (中): 三维结构损伤定位系统和方法采用分层二维阵列的电容式传感器
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Application No.: US11353443Application Date: 2006-02-14
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Publication No.: US07698075B2Publication Date: 2010-04-13
- Inventor: Mark A Curry , Simon D Senibi , David L Banks
- Applicant: Mark A Curry , Simon D Senibi , David L Banks
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: G01B3/00
- IPC: G01B3/00 ; G06F11/00

Abstract:
A system and method for detecting damage to a structure is provided. The system includes a voltage source and at least one capacitor formed as a layer within the structure and responsive to the voltage source. The system also includes at least one sensor responsive to the capacitor to sense a voltage of the capacitor. A controller responsive to the sensor determines if damage to the structure has occurred based on the variance of the voltage of the capacitor from a known reference value. A method for sensing damage to a structure involves providing a plurality of capacitors and a controller, and coupling the capacitors to at least one surface of the structure. A voltage of the capacitors is sensed using the controller, and the controller calculates a change in the voltage of the capacitors. The method can include signaling a display system if a change in the voltage occurs.
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