发明授权
- 专利标题： Characterizing across-die process variation
- 专利标题（中）： 表征跨模工艺变化
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申请号： US11946571申请日： 2007-11-28
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公开(公告)号： US07698079B2公开(公告)日： 2010-04-13
- 发明人: Dhruva J. Acharyya , Kanak B. Agarwal
- 申请人： Dhruva J. Acharyya , Kanak B. Agarwal
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Dillon & Yudell LLP
- 主分类号： G01R19/00
- IPC分类号： G01R19/00
摘要：
Measurement of individual quiescent supply currents from multiple power supply pads located across a semiconductor die provides a means of characterizing across-die variation. A ratio is created by combining the individual pad supply current with the sum of all pad supply currents for a given die. An n-tuple is formed from the set of ratios for all pad supply currents to provide a unique signature for different across-die variation profiles.
公开/授权文献
- US20090138227A1 Characterizing Across-Die Process Variation 公开/授权日：2009-05-28
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