发明授权
- 专利标题： Method and device for applying conductive paste
- 专利标题（中）： 用于涂敷导电膏的方法和装置
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申请号： US10927321申请日： 2004-08-27
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公开(公告)号： US07699020B2公开(公告)日： 2010-04-20
- 发明人: Yukio Sanada , Takeshi Ohkura , Hirokazu Naito
- 申请人： Yukio Sanada , Takeshi Ohkura , Hirokazu Naito
- 申请人地址： JP Kyoto-fu
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人地址： JP Kyoto-fu
- 代理机构： Dickstein Shapiro LLP
- 优先权： JP2003-363760 20031023
- 主分类号： B05C13/00
- IPC分类号： B05C13/00
摘要：
A tabular holding jig has a plurality of holding holes whose side walls are made from an elastic material. When electronic parts are inserted into the holding holes of the holding jig, deflection of the holding jig is prevented by (a) disposing an intermediate plate between the holding jig and a base plate, or (b) using a base plate having a stepped portion with a raised surface that covers an area of the holding jig where the plurality of holding holes is formed.
公开/授权文献
- US20050089628A1 Method and device for applying conductive paste 公开/授权日：2005-04-28
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