Invention Grant
- Patent Title: Landfill and method of decomposing refuse in a landfill
- Patent Title (中): 堆填区垃圾填埋场和垃圾分解方法
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Application No.: US12079207Application Date: 2008-03-25
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Publication No.: US07699563B2Publication Date: 2010-04-20
- Inventor: Murugappan Subbarayan , John Lawrence O'Keefe , Te-Yang Soong , Jan M. O'Keefe
- Applicant: Murugappan Subbarayan , John Lawrence O'Keefe , Te-Yang Soong , Jan M. O'Keefe
- Applicant Address: US OH Dublin
- Assignee: Virdis Waste Control, LLC
- Current Assignee: Virdis Waste Control, LLC
- Current Assignee Address: US OH Dublin
- Main IPC: B09B1/00
- IPC: B09B1/00
Abstract:
Landfills and their methods of operation are disclosed. Through the controlled introduction of septage into a wet cell having a refuse layer, refuse decomposes faster to achieve additional landfill space.
Public/Granted literature
- US20080181726A1 Landfill and method of decomposing refuse in a landfill Public/Granted day:2008-07-31
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