Invention Grant
- Patent Title: Solenoid assembly with over-molded electronics
- Patent Title (中): 具有过模制电子元件的电磁阀组件
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Application No.: US11525702Application Date: 2006-09-22
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Publication No.: US07701314B2Publication Date: 2010-04-20
- Inventor: Frederick R. Hazzard , Nathan H. French , Christopher M. Lodermeier
- Applicant: Frederick R. Hazzard , Nathan H. French , Christopher M. Lodermeier
- Applicant Address: US OH Cleveland
- Assignee: Eaton Corporation
- Current Assignee: Eaton Corporation
- Current Assignee Address: US OH Cleveland
- Agent Sonu N. Weaver
- Main IPC: H01F7/00
- IPC: H01F7/00

Abstract:
A solenoid assembly (23) includes a coil assembly (65) having at least one coil winding (73) and an electronic circuit assembly (67), which is in electrical communication with the coil assembly (65). The electronic circuit assembly (67) has a printed circuit board (79) and at least one electronic component (81), which is surface mounted on the printed circuit board (79). A coating material (85) coats all of the plurality of external surfaces of the surface-mounted electronic component (81). A casing (87) over-molds an outer longitudinal surface (77) of the coil assembly (65) and all of a plurality of external surfaces of the electronic circuit assembly (67).
Public/Granted literature
- US20080074219A1 Solenoid assembly with over-molded electronics Public/Granted day:2008-03-27
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