Invention Grant
- Patent Title: Packaging method for assembling screw on printed circuit board
- Patent Title (中): 印刷电路板螺丝装配方法
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Application No.: US12032748Application Date: 2008-02-18
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Publication No.: US07703200B2Publication Date: 2010-04-27
- Inventor: Ting-Jui Wang , Ming-De Wu
- Applicant: Ting-Jui Wang , Ming-De Wu
- Applicant Address: TW
- Assignee: Fivetech Technology Inc.
- Current Assignee: Fivetech Technology Inc.
- Current Assignee Address: TW
- Agency: Schmeiser, Olsen & Watts LLP
- Main IPC: H01R9/00
- IPC: H01R9/00

Abstract:
A packaging method for assembling a screw to a printed circuit board (PCB) includes the steps of: providing a screw having a head, a threaded shank, and a ferrule enclosing the threaded shank; mounting a stop ring on the threaded shank to maintain a predetermined height from top of the head to bottom of the ferrule; using a tool to fetch the screw and align the threaded shank with one through hole provided on the PCB; releasing the screw from the tool for a flange of the ferrule to extend into the through hole on the PCB; heating to melt a solder layer atop of the PCB, so that the ferrule is fixedly held to the PCB when the molten solder layer is cooled and hardened again; and removing the stop ring so that the threaded shank is retracted into the ferrule.
Public/Granted literature
- US20090205191A1 PACKAGING METHOD FOR ASSEMBLING SCREW ON PRINTED CIRCUIT BOARD Public/Granted day:2009-08-20
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