发明授权
- 专利标题： Heat insulating stamper structure
- 专利标题（中）： 隔热压模结构
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申请号： US10582018申请日： 2005-10-19
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公开(公告)号： US07704066B2公开(公告)日： 2010-04-27
- 发明人: Shigeru Fujita , Kazuhiro Kotaka , Nobuhiro Tanaka
- 申请人： Shigeru Fujita , Kazuhiro Kotaka , Nobuhiro Tanaka
- 申请人地址： JP Tokyo
- 专利权人： Ricoh Company, Ltd.
- 当前专利权人： Ricoh Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Dickstein Shapiro LLP
- 优先权： JP2004-306272 20041021
- 国际申请： PCT/JP2005/019642 WO 20051019
- 国际公布： WO2006/043708 WO 20060427
- 主分类号： G11B7/26
- IPC分类号： G11B7/26
摘要：
A heat insulating stamper is disclosed. The heat insulating stamper includes an uppermost section made of a metal material, a lowermost section made of the same material as the uppermost section, and a middle section having a heat conductivity lower than the uppermost section. The middle section includes the same metal material as the uppermost section and the lowermost section, and heat insulating portions.
公开/授权文献
- US20070126136A1 Heat insulating stamper structure 公开/授权日：2007-06-07
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