Invention Grant
- Patent Title: Built-up printed circuit board with stack type via-holes
- Patent Title (中): 具有堆叠型通孔的积体印刷电路板
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Application No.: US11490312Application Date: 2006-07-21
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Publication No.: US07705247B2Publication Date: 2010-04-27
- Inventor: Bong-Suck Kim , Gye-Soo Kim , Jong-Hyung Kim , Il-Woon Shin
- Applicant: Bong-Suck Kim , Gye-Soo Kim , Jong-Hyung Kim , Il-Woon Shin
- Applicant Address: KR Kyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Kyunggi-Do
- Agency: Morgan Lewis & Bockius LLP
- Priority: KR2002-79216 20021212
- Main IPC: H01R12/04
- IPC: H01R12/04 ; H05K1/11
Abstract:
A built-up printed circuit board includes stacked micro via-holes, each of which is provided for interconnection between layers in the printed circuit board, and in each of which a filling material, such as liquefied resin or conductive paste, is filled using a poly screen of a general screen printing machine.
Public/Granted literature
- US20070039753A1 Built-up printed circuit board with stack type via-holes Public/Granted day:2007-02-22
Information query
