发明授权
- 专利标题: Thickened sidewall dielectric for memory cell
- 专利标题(中): 用于存储单元的增厚的侧壁电介质
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申请号: US11847183申请日: 2007-08-29
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公开(公告)号: US07705389B2公开(公告)日: 2010-04-27
- 发明人: Ron Weimer , Kyu Min , Tom Graettinger , Nirmal Ramaswamy
- 申请人: Ron Weimer , Kyu Min , Tom Graettinger , Nirmal Ramaswamy
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Knobbe, Martens, Olson & Bear LLP
- 主分类号: H01L29/788
- IPC分类号: H01L29/788
摘要:
Methods and devices are disclosed, such as those involving memory cell devices with improved charge retention characteristics. In one or more embodiments, a memory cell is provided having an active area defined by sidewalls of neighboring trenches. A layer of dielectric material is blanket deposited over the memory cell, and etched to form spacers on sidewalls of the active area. Dielectric material is formed over the active area, a charge trapping structure is formed over the dielectric material over the active area, and a control gate is formed over the charge trapping structure. In some embodiments, the charge trapping structure includes nanodots. In some embodiments, the width of the spacers is between about 130% and about 170% of the thickness of the dielectric material separating the charge trapping material and an upper surface of the active area.
公开/授权文献
- US20090057744A1 THICKENED SIDEWALL DIELECTRIC FOR MEMORY CELL 公开/授权日:2009-03-05
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