发明授权
- 专利标题： Method for producing a conductor path on a substrate, and a component having a conductor path fabricated in accordance with such a method
- 专利标题（中）： 在基板上制造导体路径的方法以及具有根据这种方法制造的导体路径的部件
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申请号： US11122038申请日： 2005-05-05
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公开(公告)号： US07705420B2公开(公告)日： 2010-04-27
- 发明人: Mojtaba Joodaki
- 申请人： Mojtaba Joodaki
- 申请人地址： DE Heilbronn
- 专利权人： Atmel Automotive GmbH
- 当前专利权人： Atmel Automotive GmbH
- 当前专利权人地址： DE Heilbronn
- 代理机构： Muncy, Geissler, Olds & Lowe, PLLC
- 优先权： DE102004022178 20040505
- 主分类号： H01L29/86
- IPC分类号： H01L29/86
摘要：
A component having at least one conductor path on a substrate, and a production method for fabricating such a component is provided. The component is made by providing at least one conductor path on a predefined area of the substrate. Then a dielectric insulating layer is formed over the at least one conductor path, and a an area of the substrate is completely back etched below the at least one conductor path beginning on the bottom side of the substrate in such a way that the at least one conductor path is supported across the completely back-etched area of the substrate by adhesion to the second insulating layer.
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