发明授权
- 专利标题： Connection structure for connecting flexible printed circuit to main substrate using a potting resin in a through-hole
- 专利标题（中）： 使用灌封树脂在通孔中将柔性印刷电路连接到主基板的连接结构
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申请号： US11670645申请日： 2007-02-02
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公开(公告)号： US07705474B2公开(公告)日： 2010-04-27
- 发明人: Kunikazu Sato , Kazuhiro Maeno , Takamasa Nodo , Satoshi Ito
- 申请人： Kunikazu Sato , Kazuhiro Maeno , Takamasa Nodo , Satoshi Ito
- 申请人地址： JP
- 专利权人： Kabushiki Kaisha Toyota Jidoshokki
- 当前专利权人： Kabushiki Kaisha Toyota Jidoshokki
- 当前专利权人地址： JP
- 代理机构： Woodcock Washburn LLP
- 优先权： JP2006-027779 20060203
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52
摘要：
A main substrate is provided with a wiring pattern on its surface and in the inner layer. A wiring pattern for connecting the signal line or power line of the main substrate to an external circuit is formed on the flexible printed circuit. A connection terminal to which a corresponding wiring pattern is connected is formed at the tip of the flexible printed circuit. A through-hole is formed between the wiring patterns. Potting resin is potted in each through-hole and around it. When the resin hardens, the potting resin joints the main substrate and the flexible printed circuit.
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