发明授权
- 专利标题： MEMS device and interconnects for same
- 专利标题（中）： MEMS器件和互连相同
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申请号： US11613922申请日： 2006-12-20
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公开(公告)号： US07706042B2公开(公告)日： 2010-04-27
- 发明人: Wonsuk Chung , SuryaPrakash Ganti , Stephen Zee
- 申请人： Wonsuk Chung , SuryaPrakash Ganti , Stephen Zee
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM MEMS Technologies, Inc.
- 当前专利权人： QUALCOMM MEMS Technologies, Inc.
- 当前专利权人地址： US CA San Diego
- 代理机构： Knobbe, Martens, Olson & Bear LLP
- 主分类号： G02B26/00
- IPC分类号： G02B26/00
摘要：
A microelectromechanical systems device having an electrical interconnect connected to at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a movable layer of the device. A thin film, particularly formed of molybdenum, is provided underneath the electrical interconnect. The movable layer preferably comprises aluminum.
公开/授权文献
- US20080151352A1 MEMS DEVICE AND INTERCONNECTS FOR SAME 公开/授权日：2008-06-26
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