发明授权
- 专利标题: Method for integrating pre-fabricated chip structures into functional electronic systems
- 专利标题(中): 将预制芯片结构集成到功能电子系统中的方法
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申请号: US11933222申请日: 2007-10-31
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公开(公告)号: US07706887B2公开(公告)日: 2010-04-27
- 发明人: Yu-Chong Tai , Damien C. Rodger
- 申请人: Yu-Chong Tai , Damien C. Rodger
- 申请人地址: US CA Pasadena
- 专利权人: California Institute of Technology
- 当前专利权人: California Institute of Technology
- 当前专利权人地址: US CA Pasadena
- 代理机构: Foley & Lardner LLP.
- 代理商 J. Steven Rutt
- 主分类号: A61N1/18
- IPC分类号: A61N1/18
摘要:
A method (and resulting structure) for fabricating a sensing device. The method includes providing a substrate comprising a surface region and forming an insulating material overlying the surface region. The method also includes forming a film of carbon based material overlying the insulating material and treating to the film of carbon based material to pyrolyzed the carbon based material to cause formation of a film of substantially carbon based material having a resistivity ranging within a predetermined range. The method also provides at least a portion of the pyrolyzed carbon based material in a sensor application and uses the portion of the pyrolyzed carbon based material in the sensing application. In a specific embodiment, the sensing application is selected from chemical, humidity, piezoelectric, radiation, mechanical strain or temperature.
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