发明授权
- 专利标题： Semiconductor device and manufacturing method of the semiconductor device
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US12038444申请日： 2008-02-27
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公开(公告)号： US07709293B2公开(公告)日： 2010-05-04
- 发明人: Motoyuki Nishizawa
- 申请人： Motoyuki Nishizawa
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP2007-052788 20070302
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A semiconductor device where an outside connection terminal of a semiconductor element and an electrode of a wiring board are connected to each other via a conductive adhesive, the conductive adhesive includes a first conductive adhesive; and a second conductive adhesive covering the first conductive adhesive; wherein the first conductive adhesive contains a conductive filler including silver (Ag); and the second conductive adhesive contains a conductive filler including a metal selected from a group consisting of tin (Sn), zinc (Zn), cobalt (Co), iron (Fe), palladium (Pd), and platinum (Pt).
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