发明授权
- 专利标题: Lead fixation device
- 专利标题(中): 铅固定装置
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申请号: US11562725申请日: 2006-11-22
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公开(公告)号: US07711437B1公开(公告)日: 2010-05-04
- 发明人: Gene A. Bornzin , Yougandh Chitre
- 申请人: Gene A. Bornzin , Yougandh Chitre
- 申请人地址: US CA Sylmar
- 专利权人: Pacesetter, Inc.
- 当前专利权人: Pacesetter, Inc.
- 当前专利权人地址: US CA Sylmar
- 主分类号: A61N1/00
- IPC分类号: A61N1/00
摘要:
A lead fixation device that includes a helix having a surface, and a layer of electrically insulating material that covers one or more selected regions of the surface leaving one or more additional regions of the surface exposed. The insulating material defines one of a plurality of individual exposed portions along the length of the helix having a plurality of different configurations, e.g. shapes and sizes, or an insulating strip that wraps around the helix while advancing along the length of the helix.
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