Invention Grant
- Patent Title: Radiofrequency based sensor arrangement and a method
- Patent Title (中): 基于射频的传感器布置和方法
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Application No.: US10583381Application Date: 2004-12-16
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Publication No.: US07714593B2Publication Date: 2010-05-11
- Inventor: Timo Varpula , Heikki Seppä , Juha-Matti Saari
- Applicant: Timo Varpula , Heikki Seppä , Juha-Matti Saari
- Applicant Address: FI Helsinki
- Assignee: UPM-Kymmene Corporation
- Current Assignee: UPM-Kymmene Corporation
- Current Assignee Address: FI Helsinki
- Agency: Venable LLP
- Agent Eric J. Franklin
- Priority: FI20031861 20031218
- International Application: PCT/FI2004/050188 WO 20041216
- International Announcement: WO2005/059859 WO 20050630
- Main IPC: G01R27/28
- IPC: G01R27/28

Abstract:
A sensor arrangement for a sensor arrangement remotely readable by radio frequencies. The sensor arrangement includes an LC resonator that includes a capacitor and a coil, and a sensor element coupled to the LC resonator whose properties change as a function of a measurable quantity. A sensor element according to the invention does not form a direct galvanic contact with the LC resonator, rather the coupling is implemented capacitively or inductively.
Public/Granted literature
- US20070241762A1 Radiofrequency Based Sensor Arrangement and a Method Public/Granted day:2007-10-18
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