发明授权
- 专利标题: Wafer polishing apparatus and method for polishing wafers
- 专利标题(中): 晶圆抛光装置及抛光晶片的方法
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申请号: US11433701申请日: 2006-05-11
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公开(公告)号: US07717768B2公开(公告)日: 2010-05-18
- 发明人: Tomohiro Hashii , Katsuhiko Murayama , Sakae Koyata , Kazushige Takaishi
- 申请人: Tomohiro Hashii , Katsuhiko Murayama , Sakae Koyata , Kazushige Takaishi
- 申请人地址: JP Tokyo
- 专利权人: Sumco Corporation
- 当前专利权人: Sumco Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Kolisch Hartwell, PC
- 优先权: JP2005-145612 20050518
- 主分类号: B24B7/22
- IPC分类号: B24B7/22
摘要:
This wafer polishing apparatus includes: a polishing plate having a polishing pad; a carrier plate which is placed facing the polishing pad and which slides and presses wafers against the polishing pad, while rotating in a state of holding the wafers; and an abrasive slurry supply device, wherein the abrasive slurry supply device is able to supply different abrasive slurries, each of the abrasive slurries contains abrasives of which the average grain size is different from those contained in the other abrasive slurries. This method for polishing wafers includes: while supplying an abrasive slurry to a surface of a polishing pad, sliding and pressing wafers against the polishing pad, wherein different abrasive slurries are supplied to the surface of the polishing pad, and each of the abrasive slurries contains abrasives of which the average grain size is different from those contained in the other abrasive slurries.