发明授权
- 专利标题: Semiconductor device and method for manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US12133605申请日: 2008-06-05
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公开(公告)号: US07718521B2公开(公告)日: 2010-05-18
- 发明人: Masato Koyama , Akira Nishiyama , Yoshinori Tsuchiya , Reika Ichihara
- 申请人: Masato Koyama , Akira Nishiyama , Yoshinori Tsuchiya , Reika Ichihara
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2005-059396 20050303
- 主分类号: H01L21/3205
- IPC分类号: H01L21/3205
摘要:
There is disclosed a semiconductor device comprising a P-channel MIS transistor which includes an N-type semiconductor layer, a first gate insulating layer formed on the N-type semiconductor layer and containing a carbon compound of a metal, and an N-channel MIS transistor which includes a P-type semiconductor layer, a second gate insulating layer formed on the P-type semiconductor layer, and a second gate electrode formed on the second gate insulating layer.
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