发明授权
US07720655B2 Extended mainframe designs for semiconductor device manufacturing equipment
有权
用于半导体器件制造设备的扩展主机设计
- 专利标题： Extended mainframe designs for semiconductor device manufacturing equipment
- 专利标题（中）： 用于半导体器件制造设备的扩展主机设计
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申请号： US11613559申请日： 2006-12-20
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公开(公告)号： US07720655B2公开(公告)日： 2010-05-18
- 发明人: Michael R. Rice
- 申请人： Michael R. Rice
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Dugan & Dugan
- 主分类号： G06F17/50
- IPC分类号： G06F17/50 ; H01L21/00
摘要：
In a first aspect, a first mainframe is provided for use during semiconductor device manufacturing. The first mainframe includes (1) a sidewall that defines a central transfer region adapted to house a robot; (2) a plurality of facets formed on the sidewall, each adapted to couple to a process chamber; and (3) an extended facet formed on the sidewall that allows the mainframe to be coupled to at least four full-sized process chambers while providing service access to the mainframe. Numerous other aspects are provided.
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