Invention Grant
- Patent Title: Surface acoustic wave sensor and package
- Patent Title (中): 表面声波传感器和封装
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Application No.: US11966076Application Date: 2007-12-28
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Publication No.: US07730772B2Publication Date: 2010-06-08
- Inventor: James D. Cook , Brian J. Marsh , Mohammed A J Qasimi , Daniel Dixon , Sachin Kumar
- Applicant: James D. Cook , Brian J. Marsh , Mohammed A J Qasimi , Daniel Dixon , Sachin Kumar
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Main IPC: B60C23/02
- IPC: B60C23/02 ; G01L9/00

Abstract:
A wireless and batteryless pressure sensor apparatus comprises of a SAW sensor and an antenna mounted on a printed circuit board. Optionally, and RFID tag in used in combination with the SAW sensor. A sensor antenna and a RFID antenna can be located on the printed circuit board such that the antennas communicate electrically with the sensor and the RFID device. The sensor can be interrogated utilizing a radio frequency, which is used to excite a SAW crystal inside the sensor. The interrogation signal causes the SAW to resonate wherein a resonant frequency changes with the pressure and temperature that is applied to the sensor. An interrogator can receive a return (echo) signal representing a change in SAW sensor properties (e.g., diaphragm change). A printed circuit board can be mounted on a stainless steel port and overpackaged with standard processes for hermetically sealing the sensor, or sensor and RFID device with at least one antenna.
Public/Granted literature
- US20090165546A1 WIRELESS AND BATTERYLESS SENSOR Public/Granted day:2009-07-02
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