发明授权
- 专利标题： Semiconductor package
- 专利标题（中）： 半导体封装
-
申请号： US12030504申请日： 2008-02-13
-
公开(公告)号： US07732916B2公开(公告)日： 2010-06-08
- 发明人: Tsuyoshi Hasegawa
- 申请人： Tsuyoshi Hasegawa
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2007-035356 20070215
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L23/34
摘要：
A semiconductor package is provided with a package main body including a base portion configured by joining thin plates integrally, and a semiconductor device accommodating portion provided on one surface of the base portion, electric terminals electrically connected to a semiconductor device in the accommodating portion and exposed to an outer surface of the accommodating portion, and a heat high-transfer element including at least one layer-like member provided in the base portion. The layer-like member is configured independent of the base portion by a material having a thermal conductivity higher than that of the base portion, and extends from a position corresponding to a heat-generation site of the semiconductor device to a position in an outside of the heat-generation site corresponding position.
公开/授权文献
- US07652371B2 Semiconductor package 公开/授权日：2010-01-26
信息查询
IPC分类:
